Solving SiC MOSFET Packaging Complexities
The increasing popularity of wide bandgap devices requires innovative advances in packaging technology to take full advantage of WBG semiconductors.
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The increasing popularity of wide bandgap devices requires innovative advances in packaging technology to take full advantage of WBG semiconductors.
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The Microchip Graphics Suite (MGS) is an easy-to-learn, comprehensive solution that simplifies the process of integrating GUIs, animations, and graphics into touchscreen displays.
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ADI's ADAS solutions include precision sensing, intelligent power management, high-speed connectivity and data integrity.
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These power modules utilize TI's proprietary MagPack integrated magnetic packaging technology, reducing size by up to 23 percent.
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Micron's PDDR5 DRAM meets the growing demand for higher memory performance and lower power consumption across a wide range of markets, including automotive, client PCs, and networking systems built for 5G and AI applications.
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Infineon's CoolSiC MOSFET 2kV 62 mm SiC MOS half-bridge module evaluation board does just that with the EVAL-FFXMR20KM1HDR, a gate driver board for driving a 62 mm module in a half-bridge configuration using Infineon's latest CoolSiC MOSFET technology.
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